ASUS TUF Gaming Radeon RX 9070 XT OC 16GB

Model TUF-RX9070XT-O16G-GAMING
 
Graphic Engine AMD Radeon™ RX 9070 XT
Bus Standard PCI Express 5.0
OpenGL OpenGL®4.6
Video Memory 16GB GDDR6
Engine Clock
OC mode(GPU Tweak III): up to 3080 MHz (Boost Clock)/up to 2540 MHz (Game Clock)
Default mode: up to 3060 MHz (Boost Clock)/up to 2520 MHz (Game Clock)
Stream Processors 4096
Memory Speed 20 Gbps​
Memory Interface 256-bit
Resolution Digital Max Resolution 7680 x 4320
Interface Yes x 1 (Native HDMI 2.1b) Yes x 3 (Native DisplayPort 2.1a)
HDCP Support Yes (2.3)
Maximum Display Support 4
NVlink/ Crossfire Support No
Accessories
1 x TUF certificate of Reliability
1 x TUF Gaming Graphics Card Holder
1 x TUF Velcro Hook & Loop
1 x TUF Fridge Magnet
1 x Thank you card
1 x Speedsetup Manual
Software ASUS GPU Tweak III & Drivers: please download all software from the support site.
Dimensions 330 x 140 x 62.5 mm
Recommended PSU 850W
Power Connectors 3 x 8-pin
Slot 3.125 Slot
AURA SYNC RGB
Note
* Our wattage recommendation is based on a fully overclocked GPU and CPU system configuration. For a more tailored suggestion, please use the “Choose By Wattage” feature on our PSU product page: https://rog.asus.com/event/PSU/ASUS-Power-Supply-Units/index.html
* All specifications are subject to change without notice. Please check with your supplier for exact offers. Products may not be available in all markets. If you do not use the latest and current specifications of ASUS products, you shall be liable for all loss and damage claimed by third party to ASUS based on false advertising or any other issues caused from using false specifications of ASUS products.
* ‘Game Clock’ is the expected GPU clock when running typical gaming applications, set to typical TGP (Total Graphics Power). Actual individual game clock results may vary.
* ‘Boost Clock’ is the maximum frequency achievable on the GPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads.